TheDude @ LCS Postat Ianuarie 16 Postat Ianuarie 16 SK Hynix announces major investment in next-generation chip packaging SK Hynix revealed plans to invest roughly 19 trillion won (~$12.9 billion) to build a state-of-the-art chip packaging plant in South Korea. The facility aims to support advanced high-bandwidth memory (HBM) — critical for AI and data-intensive applications — responding to surging global demand. SOURCE
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